Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today that it will exhibit products and solutions at SEMICON TAIWAN 2026, a largest international exhibition in Asia to showcase the semiconductor industry’s state-of-the-art technologies and innovations scheduled to be held at Taipei Nangang Exhibition Center (TaiNEX) from Wednesday, September 02 – Friday, September 04, 2026.

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today that it will exhibit products and solutions at SEMICON TAIWAN 2026, a largest international exhibition in Asia to showcase the semiconductor industry’s state-of-the-art technologies and innovations scheduled to be held at Taipei Nangang Exhibition Center (TaiNEX) from Wednesday, September 02 – Friday, September 04, 2026.

■Nidec Advance Technology’s exhibit will include:

- 2D MEMS probe card for CIS/Memory
- TC probe with a measuring range from -40 to 200°C
- MEMS FLEX probe card (with a minimum pitch of 60μm, usable for cutting-edge devices)
- Chamber head probe card with a high-voltage-adaptive pressurized structure
- 40um, fine-pitch-adaptive Veri MEMS probe card
- 2,300mV, high-current-adaptive vertical high-current probe card
- GATS®-7886 (high-precision conduction inspection system for FOPLP/RDL)
- GATS®-7837 high-precision conduction inspection system for large, individual-piece semiconductor packages)
- GATS®-8370 (full-panel multi-unit inspection system for semiconductor packages)
- NS probe (a narrow-pitch-adaptive jig solution)
- RWi series (wafer-bump-adaptive optical 2D/3D inspection system)

- RSH series (high-density-substrate-adaptive 2D/3D inspection system)
- AURCA Series (optical-module- and large-substrate-adaptive, next-generation AI visual inspection system)
- High-precision inspection solution for TGV (Through Glass Via)
- AVR SMV 3000 (a wafer transfer robot system) *Jointly developed with Nidec Instruments Corporation